Method of molding semiconductor package

ABSTRACT

A method of molding a semiconductor package includes coating liquid molding resin or disposing solid molding resin on a top surface of a semiconductor chip arranged on a substrate. The solid molding resin may include powdered molding resin or sheet-type molding resin. In a case where liquid molding resin is coated on the top surface of the semiconductor chip, the substrate is mounted between a lower molding and an upper molding, and then melted molding resin is filled in a space between the lower molding and the upper molding. In a case where the solid molding resin is disposed on the top surface of the semiconductor chip, the substrate is mounted on a lower mold and then the solid molding resin is heated and melts into liquid molding resin having flowability. An upper mold is mounted on the lower mold, and melted molding resin is filled in a space between the lower molding and the upper molding.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit under 35 U.S.C. 119 of Korean PatentApplication No. 10-2010-0061268, filed in the Korean IntellectualProperty Office on Jun. 28, 2010, the entire contents of which areincorporated herein by reference.

BACKGROUND

The inventive concept relates to a method of molding a semiconductorpackage, and more particularly, to a method of molding a semiconductorpackage by which molding resin may be smoothly filled in a narrow gapbetween semiconductor chips and a mold.

Portable electronic devices, such as mobile telephones, PDAs, portablemusic players, and the like, have been developed to have various andincreasingly numerous functions. As a result, they have also beenincreasingly miniaturized. Semiconductor packages used in the portableelectronic devices have also been developed to have various functions,to be small, and to be thin. For example, the number of semiconductorchips arrayed in a semiconductor package has increased, while the heightof the semiconductor package has decreased.

During molding of the semiconductor package, a gap between top surfacesof the semiconductor chips and the mold becomes narrow. When the gapbetween the top surfaces of the semiconductor chips and the mold becomesnarrow, for example, when the gap is equal to or less than 150 μm,molding resin may not fill in the narrow gap in a smooth manner.

SUMMARY

The inventive concept provides a method of molding a semiconductorpackage by which molding resin may be smoothly filled in a narrow gapbetween semiconductor chips and a mold.

According to one aspect, the inventive concept is directed to a methodof molding a semiconductor package. The method includes: arranging asemiconductor chip on a substrate; applying liquid molding resin on atop surface of the semiconductor chip; mounting the substrate on a lowermold; mounting an upper mold on the lower mold; and inserting meltedmolding resin into a space between the lower mold and the upper mold.

In some embodiments, the semiconductor chip comprises a plurality ofsemiconductor chips stacked in a step manner, and applying the liquidmolding resin comprises inserting the liquid molding resin into a spacebetween the plurality of semiconductor chips and the substrate.

In some embodiments, the liquid molding resin is liquid thermosettingresin having flowability at room temperature.

In some embodiments, the liquid molding resin is applied to the topsurface of the semiconductor chip in such a manner that a thickness ofthe liquid molding resin at a center part of the top surface of thesemiconductor chip is greater than a thickness of a gap between the topsurface of the semiconductor chip and the upper mold.

In some embodiments, when the upper mold is mounted on the lower mold,the liquid molding resin applied on the top surface of the semiconductorchip is pressed by the upper mold and spreads to fill the gap betweenthe upper mold and the top surface of the semiconductor chip.

In some embodiments, a thickness of the gap between the upper mold andthe top surface of the semiconductor chip is equal to or less than about150 μm.

In some embodiments, the liquid molding resin is melted solid powderedmolding resin.

In some embodiments, the liquid molding resin is melted solid sheet-typemolding resin.

According to another aspect, the inventive concept is directed to amethod of molding a semiconductor package. The method includes:arranging a semiconductor chip on a substrate; disposing solid moldingresin on a top surface of the semiconductor chip; mounting the substrateon a lower mold; heating the solid molding resin to melt the solidmolding resin into liquid molding resin having flowability; mounting anupper mold on the lower mold; and inserting melted molding resin into aspace between the lower mold and the upper mold.

In some embodiments, the solid molding resin comprises powdered moldingresin.

In some embodiments, the solid molding resin comprises sheet-typemolding resin.

In some embodiments, a thickness of the solid molding resin is greaterthan a thickness of a gap between the upper mold and the top surface ofthe semiconductor chip.

In some embodiments, a thickness of the gap between the upper mold andthe top surface of the semiconductor chip is equal to or less than about150 μm.

In some embodiments, heating the solid molding resin comprises heatingthe lower mold.

In some embodiments, the lower mold is heated to a temperature of about180° C.

According to another aspect, the inventive concept is directed to amethod of molding a semiconductor package. The method includes:arranging a semiconductor chip on a substrate; applying liquid moldingresin on a top surface of the semiconductor chip, the liquid moldingresin being one of: 1) liquid thermosetting resin having flowability atroom temperature, ii) melted solid powdered molding resin, and iii)melted solid sheet-type molding resin; mounting the substrate on a lowermold; mounting an upper mold on the lower mold, such that, when theupper mold is mounted on the lower mold, the liquid molding resinapplied on the top surface of the semiconductor chip is pressed by theupper mold and spreads to fill a gap between the bottom-facing innersurface of the upper mold and the top surface of the semiconductor chip;and inserting melted molding resin into a space between the lower moldand a bottom-facing inner surface of the upper mold.

In some embodiments, the liquid molding resin is applied to the topsurface of the semiconductor chip such that a thickness of the liquidmolding resin at a center part of the top surface of the semiconductorchip is greater than a thickness of the gap between the top surface ofthe semiconductor chip and the bottom-facing inner surface of the uppermold.

In some embodiments, the semiconductor chip comprises a plurality ofsemiconductor chips stacked in a step manner; and further comprisinginserting the liquid molding resin into a space between the plurality ofsemiconductor chips and the substrate.

In some embodiments, a thickness of the gap between the bottom-facinginner surface of the upper mold and the top surface of the semiconductorchip is equal to or less than about 150 μm.

In some embodiments, the method further comprises heating the lower moldto heat the liquid molding resin.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing and other features and advantages of the inventive conceptwill be apparent from the more particular description of preferredaspects of the inventive concept, as illustrated in the accompanyingdrawings in which like reference characters refer to the same partsthroughout the different views. The drawings are not necessarily toscale, emphasis instead being placed upon illustrating the principles ofthe inventive concept. In the drawings, the thickness of layers andregions are exaggerated for clarity.

FIGS. 1A to 1D are schematic diagrams illustrating a semiconductorpackage molding method involving using liquid molding resin, accordingto an exemplary embodiment of the inventive concept.

FIG. 2 is a schematic diagram illustrating a semiconductor packagemolding method for a semiconductor package having a plurality ofsemiconductor chips stacked in a step manner, according to an exemplaryembodiment of the inventive concept.

FIGS. 3A and 3B are schematic diagrams illustrating a semiconductorpackage molding method involving using powdered molding resin, accordingto an exemplary embodiment of the inventive concept.

FIGS. 4A and 4B are schematic diagrams illustrating a semiconductorpackage molding method involving using sheet-type molding resin,according to an exemplary embodiment of the inventive concept.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Hereinafter, the inventive concept will be described in detail bydescribing exemplary embodiments of the inventive concept with referenceto the attached drawings.

FIGS. 1A to 1D are schematic diagrams illustrating a semiconductorpackage molding method involving using liquid molding resin, accordingto an exemplary embodiment of the inventive concept.

Referring to FIG. 1A, a substrate 10 having a semiconductor chip 20arranged thereon is prepared. In some exemplary embodiments, thesubstrate 10 may be a printed circuit board (PCB). According to theembodiments of the inventive concept, the semiconductor chip 20 may be asingle semiconductor chip. Alternatively, the chip 20 may also be formedby vertically stacking two or more semiconductor chips. Alternatively,the chip 20 may be formed by horizontally arraying a plurality ofsemiconductor chips on the substrate 10. The semiconductor chip 20 maybe electrically connected to the substrate 10 in a wire bonding manner,a flip-chip bonding manner, or another manner.

Next, as illustrated in FIG. 1B, liquid molding resin 31 is formed as acoating on a top surface of the semiconductor chip 20. In someembodiments, the liquid molding resin 31 may be liquid thermosettingresin having flowability at room temperature. For example, from amongvarious types of epoxy mold compounds (EMCs) that are generally used asmolding resin for a semiconductor package, an EMC having flowability atroom temperature may be used.

In some exemplary embodiments, the liquid molding resin 31 may be formedas a coating in such a mariner that a thickness T of the liquid moldingresin 31 at a center part of the top surface of the semiconductor chip20 is greater than a gap G between the top surface of the semiconductorchip 20 and a bottom-facing inner surface of an upper mold 52, asillustrated in FIG. 1C. In some exemplary embodiments, the liquidmolding resin 31 may be coated to completely cover the top surface ofthe semiconductor chip 20. However, this is an exemplary embodimentonly. In accordance with other exemplary embodiments, a coating areaoccupied by the liquid molding resin 31 may not completely cover the topsurface of the semiconductor chip 20. That is, in some exemplaryembodiments, it may be sufficient that the liquid molding resin 31 isformed as a coating on 50% or more of the entire top surface includingthe center part of the semiconductor chip 20.

Next, as illustrated in FIG. 1C, the substrate 10 is mounted in a mold50. Specifically, the substrate 10 is mounted on a lower mold 51, andthen the upper mold 52 is mounted on the lower mold 51. As the uppermold 52 and the lower mold 51 are brought together to be mounted, theliquid molding resin 31 coated on the top surface of the semiconductorchip 20 is pressed by the upper mold 52 so that the liquid molding resin31 spreads to fill the gap G between the bottom-facing inner surface ofthe upper mold 52 and the top surface of the semiconductor chip 20.

Next, as illustrated in FIG. 1D, melted molding resin 32 is insertedinto a space between the lower mold 51 and the upper mold 52. When themelted molding resin 32 is introduced into the space between the lowermold 51 and the upper mold 52, since the liquid molding resin 31 isalready filled in the gap G between the upper mold 52 and the topsurface of the semiconductor chip 20, the melted molding resin 32 maysmoothly fill the space. In some exemplary embodiments, the meltedmolding resin 32 may be formed by hot-melting solid thermosetting resin,e.g., a solid EMC, at a predetermined temperature.

Next, when the molding resin 31 and 32 are heated at a predeterminedtemperature and hardened, a semiconductor package molded by moldingresin is produced.

As described above, according to the present inventive concept, bypreviously applying the liquid molding resin 31 on the top surface ofthe semiconductor chip 20, the liquid molding resin 31 sufficientlyfills in the gap G, having a width equal to or less than, for example,150 μm, between the bottom-facing inner surface of the upper mold 52 andthe top surface of the semiconductor chip 20. Thus, flaws in thesemiconductor package, which may occur by insufficient filling ofmolding resin during a semiconductor package manufacturing procedure,are eliminated according to the inventive concept.

FIG. 2 is a schematic diagram illustrating a method of molding asemiconductor package according to another exemplary embodiment of theinventive concept. In the embodiment of FIG. 2, the molding methodproduces a semiconductor package having a plurality of semiconductorchips 20 stacked in a step manner, according to embodiments of theinventive concept. Referring to FIG. 2, as noted above, the plurality ofsemiconductor chips 20 is stacked on a substrate 10 in a step manner. Inthis step stacking configuration, a narrow space S is formed between thesubstrate 10 and the plurality of semiconductor chips 20, as shown inFIG. 2. According to the present inventive concept, a liquid moldingresin 31 is applied as a coating in the space S while the liquid moldingresin 31 is applied as a coating on a top surface of the plurality ofsemiconductor chips 20. By applying the liquid molding resin in thespace S, the problem that the liquid molding resin 31 is not smoothlyfilled in the space S between the substrate 10 and the plurality ofsemiconductor chips 20 is prevented.

Following the steps shown in FIG. 2, the method of molding thereafter isthe same as the molding method described in detail above with referenceto FIGS. 1C and 1D, and thus description thereof is not repeated here.

FIGS. 3A and 3B are schematic diagrams illustrating a semiconductorpackage molding method involving using powdered molding resin 34,according to another embodiment of the inventive concept. That is, inthe embodiments of the inventive concept illustrated in FIGS. 3A and 3B,a powdered molding resin 34 is used instead of the liquid molding resin31 used in the embodiments described above in detail.

Referring to FIG. 3A, according to this exemplary embodiment, asubstrate 10 having a semiconductor chip 20 arranged thereon isprepared. Next, the powdered molding resin 34 is applied as a coating ona top surface of the semiconductor chip 20. The powdered molding resin34 may be thermosetting resin, e.g., an EMC.

The powdered molding resin 34 may be applied on the top surface of thesemiconductor chip 20 in such a manner that a thickness T of thepowdered molding resin 34 at a center part of the top surface of thesemiconductor chip 20 is greater than a gap G between the top surface ofthe semiconductor chip 20 and the bottom-facing inner surface of theupper mold 52, as illustrated in FIG. 1C. In some embodiments, thepowdered molding resin 34 may be coated to completely cover the topsurface of the semiconductor chip 20. Alternatively, the powderedmolding resin 34 may be coated to cover at least about 50% or more ofthe entire top surface including the center part of the semiconductorchip 20.

Next, as illustrated in FIG. 3B, the substrate 10 is mounted on a lowermold 51. Then, the powdered molding resin 34 is heated. The heatingcauses the powdered molding resin 34 to melt into liquid molding resin34′ having flowability. In some embodiments, the heating of the powderedmolding resin 34 may be achieved via the lower mold 51. That is, in someparticular exemplary embodiments, if the lower mold 51 is heated andmaintained at a temperature of, for example, about 180° C., the powderedmolding resin 34 that is on the top surface of the semiconductor chip 20receives heat transferred from the lower mold 51 via the substrate 20and the semiconductor chip 20, and melts into a liquid state. Next, theupper mold 52 is mounted on the lower mold 51. As described above indetail with reference to FIG. 1C, as the upper mold 52 and the lowermold 51 are brought together, the liquid molding resin 34′ on the topsurface of the semiconductor chip 20 is pressed by the upper mold 52 andspread to fill the gap G between the upper mold 52 and the top surfaceof the semiconductor chip 20.

The molding method of the embodiments of FIGS. 3A and 3B thereafter isthe same as the molding method described above in detail with referenceto FIG. 1D, and thus a description thereof is not repeated here.

FIGS. 4A and 4B are schematic diagrams illustrating a semiconductorpackage molding method involving using sheet-type molding resin 36,according to another exemplary embodiment of the inventive concept. Thatis, in the exemplary embodiments of FIGS. 4A and 4B, sheet-type moldingresin 36 is used in the packaging method instead of powdered moldingresin 34 or liquid molding resin 31, described above in connection withthe other embodiments of the inventive concept.

Referring to FIG. 4A, a substrate 10 having a semiconductor chip 20arranged thereon is prepared. Next, the sheet-type molding resin 36 in asolid state is disposed on a top surface of the semiconductor chip 20.In some exemplary embodiments, the sheet-type molding resin 36 may bethermosetting resin, e.g., an EMC.

The sheet-type molding resin 36 may have a thickness T that is greaterthan a gap G between the top surface of the semiconductor chip 20 andthe bottom-facing inner surface of the upper mold 52, as illustrated inFIG. 1C. Also, in some embodiments, a size of the sheet-type moldingresin 36 may be sufficient to completely cover the top surface of thesemiconductor chip 20. Alternatively, in some exemplary embodiments, thesize of the sheet-type molding resin 36 may be sufficient to cover atleast about 50% or more of the entire top surface of the semiconductorchip, including a center part of the semiconductor chip 20.

Next, as illustrated in FIG. 4B, the substrate 10 is mounted on a lowermold 51. Next, the sheet-type molding resin 36 is heated. The heatingcauses the sheet-type molding resin 36 to melt into sheet-type moldingresin 36′ having flowability. In some particular exemplary embodiments,the heating of the sheet-type molding resin 36 may be achieved via thelower mold 51. That is, in some particular exemplary embodiments, if thelower mold 51 is heated and maintained at a temperature of for example,about 180° C., the sheet-type molding resin 36 that is disposed on thetop surface of the semiconductor chip 20 receives heat transferred fromthe lower mold 51 via the substrate 20 and the semiconductor chip 20,and melts into a liquid state. Next, the upper mold 52 is mounted on thelower mold 51. As described above in detail with reference to FIG. 1C,as the upper mold 52 and the lower mold 51 are brought together, thesheet-type molding resin 36′ on the top surface of the semiconductorchip 20 is pressed by the upper mold 52 and spread to fill the gap Gbetween the upper mold 52 and the top surface of the semiconductor chip20.

The molding method of the embodiments of FIGS. 4A and 4B thereafter isthe same as the molding method described above in detail with referenceto FIG. 1D, and thus a description thereof is not repeated here.

As described above, the effect described in relation to FIGS. 1A to 1Dmay also be achieved by the embodiments in which the powdered moldingresin 34 is previously coated on the top surface of the semiconductorchip 20, or the sheet-type molding resin 36 is disposed on the topsurface of the semiconductor chip 20.

While the inventive concept has been particularly shown and describedwith reference to exemplary embodiments thereof, it will be understoodthat various changes in form and details may be made therein withoutdeparting from the spirit and scope of the following claims.

What is claimed is:
 1. A method of molding a semiconductor package,comprising: arranging a semiconductor chip on a substrate; applyingliquid molding resin on a top surface of the semiconductor chip;mounting the substrate on a lower mold; mounting an upper mold on thelower mold; and inserting melted molding resin into a space between thelower mold and the upper mold, wherein the semiconductor chip comprisesa plurality of semiconductor chips stacked in a step manner, andapplying the liquid molding resin comprises inserting the liquid moldingresin into a space between the plurality of semiconductor chips and thesubstrate.
 2. The method of claim 1, wherein the liquid molding resin isliquid thermosetting resin having flowability at room temperature.
 3. Amethod of molding a semiconductor package, comprising: arranging asemiconductor chip on a substrate; applying liquid molding resin on atop surface of the semiconductor chip; mounting the substrate on a lowermold; mounting an upper mold on the lower mold; and inserting meltedmolding resin into a space between the lower mold and the upper mold,wherein the liquid molding resin is applied to the top surface of thesemiconductor chip in such a manner that a thickness of the liquidmolding resin at a center part of the top surface of the semiconductorchip is greater than a thickness of a gap between the top surface of thesemiconductor chip and the upper mold.
 4. The method of claim 3,wherein, when the upper mold is mounted on the lower mold, the liquidmolding resin applied on the top surface of the semiconductor chip ispressed by the upper mold and spreads to fill the gap between the uppermold and the top surface of the semiconductor chip.
 5. The method ofclaim 3, wherein a thickness of the gap between the upper mold and thetop surface of the semiconductor chip is equal to or less than about 150μm.
 6. The method of claim 1, wherein the liquid molding resin is meltedsolid powdered molding resin.
 7. The method of claim 1, wherein theliquid molding resin is melted solid sheet-type molding resin.
 8. Amethod of molding a semiconductor package, comprising: arranging asemiconductor chip on a substrate; applying liquid molding resin on atop surface of the semiconductor chip, the liquid molding resin beingone of: i) liquid thermosetting resin having flowability at roomtemperature, ii) melted solid powdered molding resin, and iii) meltedsolid sheet-type molding resin; mounting the substrate on a lower mold;mounting an upper mold on the lower mold, such that, when the upper moldis mounted on the lower mold, the liquid molding resin applied on thetop surface of the semiconductor chip is pressed by the upper mold andspreads to fill a gap between the bottom-facing inner surface of theupper mold and the top surface of the semiconductor chip; and insertingmelted molding resin into a space between the lower mold and abottom-facing inner surface of the upper mold.
 9. The method of claim 8,wherein the liquid molding resin is applied to the top surface of thesemiconductor chip such that a thickness of the liquid molding resin ata center part of the top surface of the semiconductor chip is greaterthan a thickness of the gap between the top surface of the semiconductorchip and the bottom-facing inner surface of the upper mold.
 10. Themethod of claim 8, wherein the semiconductor chip comprises a pluralityof semiconductor chips stacked in a step manner; and further comprisinginserting the liquid molding resin into a space between the plurality ofsemiconductor chips and the substrate.
 11. The method of claim 8,wherein a thickness of the gap between the bottom-facing inner surfaceof the upper mold and the top surface of the semiconductor chip is equalto or less than about 150 μm.
 12. The method of claim 8, furthercomprising heating the lower mold to heat the liquid molding resin.